Faster, more robust & more performant
SiP/AiP devices
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Circuits Integrated
CI is a new and dynamic technology company developing innovative solutions and products for Satcom, 5G & IoT industry. The company has increased its revenues by x5 in the past 2 years, recently breaking the barrier of €1M with market-driven sales.
TECHNOLOGY
CI is IC from concept to production.
CI has a proven track record in the development of performant and robust designs in various Silicon technologies for beamforming and other telecom applications while delivering several IC developments from concept to production.
Committed to innovation and continuous improvement (architectural and implementation concepts), CI has accumulated expertise in the Analog and RF communication path and a constantly growing proprietary IP library while delivering on high-speed mixed signal designs and digital circuitry.
Familiar with advanced technology nodes – down to 55nm nodes for BiCMOS technology, 22nm nodes for CMOS and FDSOI technology, and 3nm nodes for FinFet Layouts – CI provides a high flexibility skillset suitable for aggressively tackling the most challenging requirements in the most demanding developments.
CI is more than just Silicon.
Delivering its MVP on advanced III-V Compounds IC such as GaAs and GaN, CI intends to radically step-up the integration level in such technologies, providing unprecedented cost reductions at uncompromised performance for high frequency, high-power and low-noise high-end applications impacting several industries and applications.
Complementing its fore-front R&D developments of compound ICs, with the MVP, CI is executing on its “CI35” product roadmap of new packages for integrations of Si and Compound technologies: faster, more robust, more performant and feature-rich integrations enabled by proprietary non-conventional approaches and manufacturing recipes.
CI is in the unique position to disrupt the market with its packaged Si, GaAs and GaN co-designs.
OUR PRODUCTS
MORE THAN JUST A CHIP
SMALLER SIZE
(SIP – 1 MMIC REPLACES 2 PAs + 1 SPDT)
LOWER COST
EFFICIENCY
AT UNCOMPROMISED PERFORMANCE
CI MMICs accelerate communications for LEO-MEO SatCom industry. CI holds the key for upgrading performance on low-power, high-efficiency NextG antennas.
Our MVP design opens the path to 3DIC GaAs/GaN and Si SiP integrations.
A novel and proprietary CI architecture is used in a PA module that can drive either one of two outputs replacing typical discrete implementations utilizing two or more MMICs at uncompromized performance …
APPLICATION & INDUSTRIES
Globally, MMIC devices are used as component of choice for numerous high-frequency applications. The adoption of MMIC is largely based upon advantages such as reduced size, low cost, and high reproducibility capabilities. Global MMIC market is experiencing a boost based on its increasing implementation in smartphones and the increasing bandwidth requirements various industrial sectors.
Maritime - Naval
Government services for digitalization of economies
Fleet management
Military / defense
Remote asset maintenance
Space
Emergency response
Satellite Communications
Reliable connectivity for automobiles, trains, ships, & aircraft in the transportation business
IoT
Direct services to the consumer market, including places with limited or no service
Automotive
Flat panel antennas
Smartphone
IoT – low power Communications IC designs
Commercial Aviation
5G communication services for IoT devices
CI aspires to become a leading chip supplier for the Satcom industry by incorporating its proprietary technology In beamforming, MMIC, 3DIC, and SiP / AiP Integration.
SOLUTIONS
CI is a specialist in MMIC GaAs / GaN design, with a growing IP portfolio (10 + IP products), over 30 tape-outs and a large variety of foundry processes.
OUR TRUSTED R&D PARTNERS
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MORE THAN JUST A COMPANY
We aim to attract, engage and retain a high performing, diverse workforce—and believe a fun and casual culture of inclusion drive our employees to achieve their full potential.