FASTER, UBIQUITOUS, DOWNTIME-FREE COMMUNICATIONS

CI is IC from concept to production.

CI has a proven track record in the development of performant and robust designs in various Silicon technologies for beamforming and other telecom applications while delivering several IC developments from concept to production.

Committed to innovation and continuous improvement (architectural and implementation concepts), CI has accumulated expertise in the Analog and RF communication path and a constantly growing proprietary IP library while delivering on high-speed mixed signal designs and digital circuitry.

Familiar with advanced technology nodes – down to 55nm nodes for BiCMOS technology, 22nm nodes for CMOS and FDSOI technology, and 3nm nodes for FinFet Layouts – CI provides a high flexibility skillset suitable for aggressively tackling the most challenging requirements in the most demanding developments.

CI is more than just Silicon.

Delivering its MVP on advanced III-V Compounds IC such as GaAs and GaN, CI intends to radically step-up the integration level in such technologies, providing unprecedented cost reductions at uncompromised performance for high frequency, high-power and low-noise high-end applications impacting several industries and applications.

Complementing its fore-front R&D developments of compound ICs, with the MVP, CI is executing on its “CI35” product roadmap of new packages for integrations of Si and Compound technologies: faster, more robust, more performant and feature-rich integrations enabled by proprietary non-conventional approaches and manufacturing recipes.

CI is in the unique position to disrupt the market with its packaged Si, GaAs and GaN co-designs.