Satcom Products

Enabling the Future of Flat Panel Antenna Design with Kythrion™

Circuits Integrated is redefining what’s possible in satellite communications with Kythrion™, a breakthrough chipset platform purpose-built for high-performance, scalable, and sustainable flat panel antenna (FPA) systems.

Engineered from the ground up, Kythrion is the first platform to unify transmit, receive, and antenna functionality within a proprietary 3D antenna-in-package (AiP) and system-in-package (SiP) architecture. By vertically integrating III-V semiconductors such as GaAs and GaN with silicon-based technologies, Kythrion achieves a 60% reduction in size, weight, power, and cost (SWaP-C) without sacrificing thermal or RF performance.

The Kythrion Difference

• Ultra-Compact Design
  Eliminates traditional PCB layers by consolidating RF, logic, and antenna elements into a dense, vertically stacked chip.
• Exceptional Bandwidth
  Delivers up to 20x bandwidth improvements for real-time, high-throughput connectivity on Earth observation, including low Earth-orbit (LEO) satellites.
• Sustainable Innovation
  Built using standard semiconductor materials and manufacturing processes, Kythrion reduces the environmental and financial cost of deployment.
• Versatile Deployment
  Available as a flexible platform supporting chip-level sales, design-for-license models, or custom integration into mission-specific applications.

Kythrion is designed to address the limitations of legacy flat panel phased array antennas, which often contribute significant mass and complexity to satellite payloads. With Kythrion, Satcom operators can scale advanced sensor payloads, extend mission life, and reduce launch costs without needing larger boosters or redesigning entire spacecraft.

Why Kythrion?

The name Kythrion merges two powerful concepts: Kyma (Greek for “wave”), symbolizing the seamless flow of electromagnetic and satellite signals, real-time data exchange, and the fluidity of innovation; and Thyrion (Greek for “portal”), representing a gateway to the future of communication—enabling smooth, sustainable transitions between space-bound systems and the Earth below.