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ABOUT CIRCUITS INTEGRATED

CI is a new and dynamic technology company developing innovative solutions and products for SatCom, 5G & IoT industry.

The company has increased its revenues by x5 in the past 2 years,

recently breaking the barrier of €2M per year with market driven sales.

The two founders met in 2010 at Theta Microelectronics, the first major IC company in Greece with presence in the US.

In 2018, the founders landed their major project, a “first-pass silicon” success which kickstarted CI:
Analog Beam Forming chipsets for flat panel antennas (SatCom-on-the-move) for the next generation electrically steerable antennas.

The innovative chip designs that CI offers are about to become key to a new generation of phased array antennas for 5G and LEO-MEO.

THE FUTURE IS NOW

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OUR HISTORY

OUR HISTORY201020182019201920202022The founders met by working together in Theta Microelectronics Secured a SatCom project with major technology company (2018, analog beam forming chipsets)Kickstart CI in Greece to capitalize on their innovative chip design for the new generation of phased array antennasCI’s growing team operates from its 300 sqm Offices in Kifissia, AthensRevenues produced to date > €750kEnters ESA-BIC

CI's MILESTONES

OUR KEY PROJECTS

2019

Part Design of new silicon chip (2019): Simulation, design, modelling of new approaches for phased array antennas

2020

Design & consulting services: RFIC design (radio freq. Integrated circuits) for telecom applications

2021

Full Design of power amplifier IC modules for satcom antennas

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OUR VISION IS TO FACILITATE ACCESS TO FASTER, UBIQUITOUS, DOWNTIME-FREE COMMUNICATIONS AROUND THE GLOBE.

CI aspires to become a leading chip supplier for the Satcom Industry by incorporating its proprietary technology in beamforming, MMIC, 3DIC and SiP / AiP integration.

MMIC

Monolithic Microwave Integrated Circuit

An integrated circuit operating in Microwave (300MHz-300GHz) frequencies

3DIC

3D Integrated circuit

A 3DIC is a three-dimensional integrated circuit (IC) built by vertically stacking different chips or wafers together into a single package

SIP

System in Package

A way of bundling two or more ICs inside a single package

AIP

Antenna in Package

A package design allowing an mmWave antenna to seamlessy interface with an MMIC

THE FACES OF

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Dr. Paolo Fioravanti (CEO)

Dr. Ioannis Kontogiannopoulos (CTO)

The CI Crew

Synklisi is a technology – business development specialist bridging the gap between innovation and commercial application. Its mission is to devise the means necessary and facilitate the technological transfer from where it’s born to the marketplace.

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